CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF,申请号KR20050022167-传众专利搜索

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发明名称	CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF
摘要
申请公布号	KR20060100557(A)	申请公布日期	2006.09.21
申请号	KR20050022167	申请日期	2005.03.17
申请人	LG INNOTEK CO., LTD.	发明人	SHIN, YANG HO
分类号	H01L23/28	主分类号	H01L23/28
代理机构		代理人
主权项
地址

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