| 摘要 |
PROBLEM TO BE SOLVED: To provide two circuit board resin bonding structures to be bonded which is valid for preventing Ag ion migration generation/growth between wires. SOLUTION: A first circuit board having wiring electrodes arranged in a row, and a second circuit board having wiring electrodes constituted of wiring materials which are different from the wiring materials corresponding to wiring, are electrically connected through bonding resin for bonding in this resin bonding structure. The wiring electrode width of one of those circuit boards is made thinner than the wiring electrode width of the other. Also, in the first and second circuit boards, the wiring electrode whose wiring width is thin contains Ag, and adhesive resin for bonding is anisotropic conductive adhesive. COPYRIGHT: (C)2006,JPO&NCIPI
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