| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for managing the equipment program of a semiconductor fabrication system in which management is simple even when the number of files of equipment programs is extremely large, and significant manhour is not required for selecting the equipment program. SOLUTION: The system 100 for managing the equipment program of a bonding unit which can perform bonding processing on a plurality of kinds of product comprises a file server for storing a plurality of kinds of equipment program set, respectively, for every kind of product and every serial number of bonding unit, a monitor for displaying the list of equipment programs on a screen by indicating such that the fact whether a equipment program corresponding to a combination of row element and a column element of every cell is stored in the file server or not can be recognized at each cell where the row and column of a matrix intersect with one of the row or column indicating the kind of product and the other indicating the serial number of bonding unit, and a mouse for selecting an arbitrary cell among a plurality of cells by means of a pointer 90. COPYRIGHT: (C)2006,JPO&NCIPI
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