发明名称 |
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, PROCESS FOR PRODUCING SEMICONDUCTOR SUBSTRATE, AND PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To form a semiconductor layer on an insulator inexpensively while suppressing the generation of particles from the semiconductor layer. SOLUTION: After a trench 8a for exposing the sidewall of a second semiconductor layer 3 is formed, the sidewall of the second semiconductor layer 3 is heat treated under N<SB>2</SB>gas atmosphere to form a protective film 30 on the sidewall of a second semiconductor layer 3. A trench 8b for exposing a portion of a first semiconductor layer 2 is formed by etching the first semiconductor layer 2 while digging the trench 8a, and a cavity 9 is formed between a semiconductor substrate 1 and the second semiconductor layer 3 by touching etching liquid to the first semiconductor layer 2 through the trenches 8a and 8b and removing the first semiconductor layer 2 by etching. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006253258(A) |
申请公布日期 |
2006.09.21 |
申请号 |
JP20050064993 |
申请日期 |
2005.03.09 |
申请人 |
SEIKO EPSON CORP |
发明人 |
HARA HISAKI |
分类号 |
H01L21/76;H01L27/12;H01L29/786 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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