发明名称 SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, PROCESS FOR PRODUCING SEMICONDUCTOR SUBSTRATE, AND PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To form a semiconductor layer on an insulator inexpensively while suppressing the generation of particles from the semiconductor layer. SOLUTION: After a trench 8a for exposing the sidewall of a second semiconductor layer 3 is formed, the sidewall of the second semiconductor layer 3 is heat treated under N<SB>2</SB>gas atmosphere to form a protective film 30 on the sidewall of a second semiconductor layer 3. A trench 8b for exposing a portion of a first semiconductor layer 2 is formed by etching the first semiconductor layer 2 while digging the trench 8a, and a cavity 9 is formed between a semiconductor substrate 1 and the second semiconductor layer 3 by touching etching liquid to the first semiconductor layer 2 through the trenches 8a and 8b and removing the first semiconductor layer 2 by etching. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006253258(A) 申请公布日期 2006.09.21
申请号 JP20050064993 申请日期 2005.03.09
申请人 SEIKO EPSON CORP 发明人 HARA HISAKI
分类号 H01L21/76;H01L27/12;H01L29/786 主分类号 H01L21/76
代理机构 代理人
主权项
地址
您可能感兴趣的专利