发明名称 ALIGNMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an alignment device capable of effectively utilizing heat generated by an exposure means when alignment exposure is carried out. <P>SOLUTION: The alignment device is equipped with an alignment detecting means 11 for detecting an alignment mark, a mask fixing means 12 for fixing a mask 13 where a pattern for exposure is formed, a wafer fixing means 14 for fixing a wafer 15, a stage moving means 17 of moving a stage on which the wafer fixing means is mounted in respective directions X, Y, Z, and &theta;, and the exposure means 20a for exposing the wafer 15 to the pattern of the mask 13. Further, the device is equipped with a heat pipe 31 moving heat from the exposure means 20a, a thermoelectric converting means 33, and an accumulating means 44 of accumulating electricity generated by conversion. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006253602(A) 申请公布日期 2006.09.21
申请号 JP20050071681 申请日期 2005.03.14
申请人 RICOH CO LTD 发明人 HIKIJI SHUICHI
分类号 H01L21/027;G03F7/20 主分类号 H01L21/027
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