| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being mounted rationally on an instrument without spoiling heat dissipating function. SOLUTION: The semiconductor device with a heat dissipating body 3 abutted against one surface of a device main body 2 is constituted of a plurality of circuits, a plurality of circuits classified into a circuit 4 having a large generating amount of heat and another circuit 5 having a small generating amount of heat while being arranged concentrically in every classifications, and the heat dissipating body 3 abutted against a local part on one surface of the device main body 2 opposed to the site of concentrated arrangement of the circuit 4 having a large amount of generated heat. COPYRIGHT: (C)2006,JPO&NCIPI
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