| 摘要 |
PROBLEM TO BE SOLVED: To detect contamination on a tool surface even if equipment is in operation. SOLUTION: A contamination detecting section 13 detects contamination 8 on the stage surface 2a based on the image of the tool surface 4a picked by an alignment camera 5. When the contamination 8 of a compression tool 4 is detected at the contamination detecting section 13, a tool replacing section 16 replaces a compression tool 4 from which the contamination 8 is detected by a preliminary compression tool 24 and compresses a semiconductor chip C3 to a mounting substrate T by using the replaced preliminary compression tool 24, thus mounting the semiconductor chip C3 to a mounting substrate T. COPYRIGHT: (C)2006,JPO&NCIPI
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