| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents the reduction of the thermal fatigue life of the semiconductor device due to the degradation of a junction member by relaxing the pretension stress to a lead electrode body. <P>SOLUTION: The semiconductor device is constituted such that a case electrode body 3 is connected to a heat dissipation board for mounting, and a lead 5c of a lead electrode body 5 is connected to a terminal 8 for mounting. The rigidity of the bent part 5b of the lead electrode body is reduced so that the junction member can relax the pretension stress to such a grade that junctions 2 and 4 of the semiconductor does not degrade against the pretension deformation generated in a lead which is caused by thermal deformation at the time of use. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
