PIEZOELECTRIC OSCILLATING PIECE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING DEVICE THEREOF

摘要

PROBLEM TO BE SOLVED: To suppress variation or degradation in characteristics of a piezoelectric oscillating piece by improving working precision on piezoelectric oscillating pieces when manufacturing multiple piezoelectric oscillating pieces from a wafer.

SOLUTION: The manufacturing device of a quartz oscillating piece 1 includes a cutting/molding part 3 which cuts a wafer 2 in the direction of X and Z' axes of the wafer 2 and molds the form of quartz oscillating piece 1 in the direction of X and Z' axes on the basis of the preset dimension of the quartz oscillating piece 1. The cutting/molding part 3 is provided with a cutting part 31 for cutting the wafer 2 and a molding part 32 for molding into preset shape of the quartz oscillating piece 1, with the cutting part 31 and the molding part 32 integrally formed with a center axis 36 as a common axis. The cutting/molding part 3 performs cutting of the wafer 2 and convex processing on the quartz oscillating piece 1 by rotating the cutting part 31 and the molding part 32 with the center axis 36 as a center while moving a table 4 in the direction of X and Z' axes.

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