| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for optical semiconductor device encapsulation which has a small internal stress and an excellent light transmittance. <P>SOLUTION: The hardened article is formed by using the epoxy resin composition for optical semiconductor device encapsulation which contains the following components (A)-(D). Silicone resin particles with a particle size of 1-100 nm, the component (C) are uniformly dispersed in the hardened article, (A): an epoxy resin, (B): an acid anhydride-based hardener, (C): a silicone resin melt-miscible with the epoxy resin (A) and (D): a hardening promotor. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
