摘要 |
In one embodiment a method is provided. A method comprising forming a plurality of electromechanical formations to electromechanical couple a first printed circuit board to a second printed circuit board, wherein each electromechanical formation is of a first size; and forming at least one anchoring formation to anchor the first printed circuit board to the second printed circuit board, each anchoring formation being formed at a selected anchor point, and being of a second size which is greater than the first size.
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