发明名称 Method of mounting a substrate to a motherboard
摘要 In one embodiment a method is provided. A method comprising forming a plurality of electromechanical formations to electromechanical couple a first printed circuit board to a second printed circuit board, wherein each electromechanical formation is of a first size; and forming at least one anchoring formation to anchor the first printed circuit board to the second printed circuit board, each anchoring formation being formed at a selected anchor point, and being of a second size which is greater than the first size.
申请公布号 US2006203459(A1) 申请公布日期 2006.09.14
申请号 US20050078930 申请日期 2005.03.11
申请人 MORGAN THOMAS O;AMIR DUDI;SEARLS DAMION 发明人 MORGAN THOMAS O.;AMIR DUDI;SEARLS DAMION
分类号 H05K7/06 主分类号 H05K7/06
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