| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid state imaging apparatus having a thickness smaller than that of a conventional one. <P>SOLUTION: This solid state imaging apparatus comprises a wiring board 2, a solid state imaging device 13 fixed to the wiring board 2, and a light-transmissive lid 17 fixed to the solid state imaging device 13 so that it covers the imaging surface (effective pixel region surface) 14. The wiring board 2 has a through-hole 3 in the thickness direction, and at least a part of the light-transmissive lid 17 is fitted into the through-hole 3, and the connecting terminals 9 of the wiring board 2 are connected to the connecting terminals 15 of the solid state imaging device 13, respectively. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
