| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic electronic component, with which elution of Ba from an electronic component element is hard to occur, fusion of the electronic component elements by an Sn plating film is hard to occur and soldering property is sufficient. SOLUTION: The method comprises a process for preparing the electronic component element constituted by using Ba-containing ceramic, and a process for forming an electrode on an outer face of the electronic component element. The electrode has the Sn plating film formed of electroplating. A plating bath whose Sn ion concentration A is 0.03 to 0.51 mol/L, sulfate ion concentration B is 0.005 to 0.31 mol/L, mol ratio B/A is less than "1", and pH is within a range of 6.1 to 10.5, is used as the plating bath used when the Sn plating film is formed. COPYRIGHT: (C)2006,JPO&NCIPI
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