发明名称 METHOD AND DEVICE FOR ANALYZING AND MEASURING TEMPERATURE OF GRINDING OBJECT
摘要 PROBLEM TO BE SOLVED: To provide method and device for analyzing the temperature distribution of a grinding object to obtain highly accurate temperature distribution data. SOLUTION: One of a thermocouple 10 is buried in the grinding object 2 along the radial direction, and the buried part is ground by a grinding tool 8. A PC 18 collects temperature measured by the thermocouple 10 received by a receiver 20 and machining diameter data measured by a sizing device 16 by detecting timing of the buried position of the thermocouple 10 by a phase detecting machine having a magnet 12 and a magnetic sensor 14, and preserves the temperature and the data by corresponding. When an abnormal value of the measured temperature is detected since a grinding point of the grinding tool 8 and a hot junction of the thermocouple 10 are made to coincide with each other by further cutting into the object 2 to be ground and the hot junction is ground, the PC 18 terminates the grinding. A point that the grinding point and the hot junction coincide with each other is made as an origin of a coordinate axis showing a distance in the temperature distribution coordinate, and the collected data is plotted on the temperature distribution coordinate to obtain a temperature distribution curve (the temperature distribution data). COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006231438(A) 申请公布日期 2006.09.07
申请号 JP20050047608 申请日期 2005.02.23
申请人 TOYOTA MOTOR CORP;KURENOOTON KK;MEIWA E TEC:KK 发明人 SATO MASAAKI;EGUCHI TAKASHI;KAGEURA KAZUHIKO;UEDA HIDEO
分类号 B24B49/14;B24B5/00 主分类号 B24B49/14
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