| 摘要 |
<p>A laminate which is advantageously used as an insulating layer for electronic package application and as an adhesive film for fixing a semiconductor wafer for semiconductor device application, laminates comprising the same and a process for manufacturing the above laminate. The laminate (I) comprises a base layer (A) and an adhesive layer (B) formed on one side or both sides of the layer A, the layer A is a film made of (A-1) a specific wholly aromatic polyimide (PI A-1 ) or (A-2) a specific wholly aromatic polyamide (PA A-2 ) and the layer B comprises (B-1) a specific wholly aromatic polyimide (PI B-1 ), (B-2) a specific wholly aromatic polyamide (PA B-2 ), or (B-3) a specific resin composition (RC B-3 ) comprising a wholly aromatic polyimide (PI B-3 ) and a specific wholly aromatic polyamide (PA B-3 ), laminates comprising the same and a process for manufacturing the above laminate.</p> |
