发明名称 Method of and apparatus for laminating disc-shaped substrates
摘要 <p>There is provided a method of and an apparatus for laminating disc-shaped substrates capable of automatically bonding an adhesive agent to the disc-shaped substrates very effectively and continuously. The method of laminating disc-shaped substrates comprising preparing an adhesive sheet body (S) comprising a plurality of adhesive agents (S2) each covered with a release paper (S3), peeling off the release paper (S3) from the adhesive sheet body (S), positioning the adhesive sheet body (S) from which the release paper (S3) is peeled off over a lower disc-shaped substrate (D1), pressing the adhesive sheet body (S) to allow the adhesive agent (S2) adhered to the lower surface of the adhesive sheet body (S) to bond or transfer onto a surface of the lower disc-shaped substrate (D1), peeling off the adhesive sheet body (S) from the adhesive agent (S2) bonded onto the surface of the lower disc-shaped substrate (D1), placing an upper disc-shaped substrate (D2) on the lower disc-shaped substrate (D1), pressing the upper disc-shaped substrate (D2) against the lower disc-shaped substrate (D1), thereby bonding the lower disc-shaped substrate (D1) and the upper disc-shaped substrate (D2). The laminating apparatus for laminating disc-shaped substrates comprising a holding table (2) to place a lower disc-shaped substrate (D1) thereon, supporting members (tension rollers 5A, 5B) for extending an adhesive sheet body (S) therebetween at a given interval over the holding table (2), a centering shaft (3) for positioning the adhesive sheet body (S), a laminating roller (1) for pressing the adhesive sheet body (S) against the lower disc-shaped substrate (D1) to bond the adhesive sheet body (S) onto the lower disc-shaped substrate (D1) while moving on the lower disc-shaped substrate (D1) from one end thereof to the other thereof, and a peeling member (4) for peeling off the adhesive sheet body (S) bonded onto the lower disc-shaped substrate (D1) from the lower disc-shaped substrate (D1). <IMAGE></p>
申请公布号 EP0932149(B1) 申请公布日期 2006.09.06
申请号 EP19990101392 申请日期 1999.01.26
申请人 KITANO CO., LTD. 发明人 AMO, MIKUNI
分类号 G11B7/26;B29C63/00;B29C65/52;B32B37/00;B32B38/16 主分类号 G11B7/26
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