发明名称 |
Method for flip chip bonding by utilizing an interposer with embedded bumps |
摘要 |
The present invention relates to a method for flip chip bonding by utilizing an interposer with embedded bumps. The method comprises (a) providing a first element having a first surface; (b) forming an interposer onto the first surface; (c) forming a plurality of openings on the interposer; (d) forming a plurality of bumps in the openings, wherein the height of the bumps is smaller than the depth of the openings; (e) providing a second element having a plurality of pre-solders; and (f) bonding the first surface onto the second element, so that the pre-solders are disposed in the openings and in contact with the bumps. As a result, the self-alignment between the pre-solders and the bumps can avoid the shift between the first element and the second element.
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申请公布号 |
US7098071(B2) |
申请公布日期 |
2006.08.29 |
申请号 |
US20050136181 |
申请日期 |
2005.05.24 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
HO MING-LUN;CHUNG CHIH-MING |
分类号 |
H01L21/44;H01L21/00;H01L21/56;H01L21/60;H05K3/34 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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