| 摘要 |
A cooling device including a housing with at least one cooling channel for cooling a liquid, and with at least one thermoelectric cooling element including a layer of semiconductor material that is sandwiched between two plates, at least one of the plates having an electrically insulating contact surface that, in use, is in direct contact with the cooling liquid, the at least one cooling element being sealingly mounted in a carrier such that the contact surface remains free to contact the cooling liquid, the carrier and the contact surface defining a wall portion of the cooling channel, wherein the at least one cooling element is along its outer perimeter of the at least one cooling element being formed by the outer edges of the surface of at least one of the plates and at least a portion of the rim.
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