| 摘要 |
PURPOSE: A method of wire bonding is to recognize bonding point during a process of wire bonding, thereby reducing a packaging time. CONSTITUTION: A CPU(100) for wire bonding allocates all of the chips to a serial number. The serial number is allocated with order which the chips enter a window clamper. The ith chip is initialized as value of 1. The ith chip is moved to a main operating region of the window clamper. A camera of a bond head is moved to a serve operating region. At this time, an image of the chip is obtained. The camera is then moved to the main operating region. After obtaining the image positioned in the main operation region, the bonding point of the ith chip is recognized. When the wire bonding of the ith chip is completed, the wire bonding of the (i+1)th chip is continuously performed. If the chip which is not wire-bonded remains, the value of 'i' is increased with two chips unit. |
