发明名称 |
METHOD AND ARRANGEMENT FOR CONTACT-CONNECTING SEMICONDUCTOR CHIPS ON A METALLIC SUBSTRATE |
摘要 |
The method comprises the following steps: the substrate in the form of a one- piece basic substrate (4) is prepattemed into regions corresponding to future modules, pads of the semiconductor chip (1 ) are then contact-connected in predetermined regions of a first area of the basic substrate (4) and on the top side (12) of the prepattemed basic substrate (4) and on one area side of the semiconductor chip (1 ) a first adhesive layer (16) is applied, a second adhesive layer (17) is subsequently applied to the other area side of the semiconductor chip (1 ), and a curing of the adhesive layers (16, 17) and a final patterning of the metallic basic substrate (4) are then effected. |
申请公布号 |
WO2006087686(A2) |
申请公布日期 |
2006.08.24 |
申请号 |
WO2006IB50524 |
申请日期 |
2006.02.17 |
申请人 |
ASSA ABLOY IDENTIFICATION TECHNOLOGY GROUP AB;MICHALK, MANFRED;NIELAND, SABINE;MICHALK, MARTIN |
发明人 |
MICHALK, MANFRED;NIELAND, SABINE;MICHALK, MARTIN |
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