| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition having excellent surface flatness, adhesiveness, heat resistance, flexibility and printability and a semiconductor device produced by using the composition. <P>SOLUTION: The resin composition contains (A) an aromatic thermoplastic resin soluble in a polar solvent at room temperature, (B) an aromatic thermoplastic resin insoluble in a polar solvent at room temperature but soluble by heating, (C) a filler having an average particle diameter of 0.1-6μm and a particle diameter distribution of 0.01-15μm and exhibiting rubber elasticity, and (D) a polar solvent. The storage elastic moduli of the composition measured by a rheometer at 1Hz under shear stress of 10 Pa and 1,000 Pa are≥1,600 Pa and <1,000 Pa, respectively, and the storage elastic modulus ratio (storage modulus (Pa) under shear stress of 10Pa)/(storage modulus (Pa) under shear stress of 1,000Pa) is≥2. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
