| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board capable of preventing pads or lands from being exfoliated, the pads or the lands being compatible with surface mount components as well as DIP components without much changing the configuration of printed wiring boards of prior arts. <P>SOLUTION: The multilayer printed wiring board 100 comprises a plurality of insulation layers 11, 12, 13, 14, 15 and a plurality of conductor layers L1, L2, L3, L4, L5, L6; and the first layer L1 of an outermost conductor layer is provided with a signal pattern 30. The first layer L1 includes a plurality of the pads each located at a position opposed to each of a plurality of signal terminals 200b of a connector component 200 arranged in a prescribed form, and electrically connected to each of the signal terminals; reinforcement parts each extended from each of the pads in the lengthwise direction; and the lands for connecting the electric connection to the second layer L2. Further, a solder resist 21 for covering the reinforcement parts and including openings for exposing the pads is covered on the first layer L1. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
