发明名称 METHOD OF FORMING CAPACITOR FOR SUBSTRATE WITH BUILT-IN COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of forming a capacitor having a high capacitance even if it uses a dielectric filler, and an insulating resin consisting of a resin for a dielectric layer. <P>SOLUTION: On a bottom electrode formed on an insulating substrate, the dielectric layer is formed which consists of a paste-like or film-like dielectric substance which is a mixture of the dielectric filler and the insulating resin. After conducting a treatment by laser in advance, a top electrode is formed. By this method, a capacitor can be formed which has a larger capacitance value than the conventional one. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006222189(A) 申请公布日期 2006.08.24
申请号 JP20050032676 申请日期 2005.02.09
申请人 TOPPAN PRINTING CO LTD 发明人 OKANO TATSUHIRO;NOMURA HIROATSU;SAEKI AKIKO
分类号 H01G4/12;H05K1/16;H05K3/46 主分类号 H01G4/12
代理机构 代理人
主权项
地址