发明名称 SOLID-STATE IMAGE SENSOR AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent a lowering in embedding of a core member in an optical waveguide provided in a solid-state image sensor to improve an incidence efficiency. SOLUTION: The core member of the optical waveguide 10 efficiently guides the light formed in a light receiving part 21 direction through a plurality of interlayer insulating films 3, 4, 5, 8 and a protective film 9 formed on the light receiving part 21 formed on a semiconductor substrate 1 and entering from an on-chip lens 13 to the light receiving part 21. Using a TiO distributed polyimide resin having a high refraction factor of 1.8 to 1.9 due to the TiO distribution as the core member prevents the lowering in embedding of the core member in the optical waveguide 10 and can improve the incidence efficiency to the light receiving part 21. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006222270(A) 申请公布日期 2006.08.24
申请号 JP20050034360 申请日期 2005.02.10
申请人 SONY CORP 发明人 TOUMIYA YOSHITETSU
分类号 H01L27/14;H04N5/335;H04N5/369;H04N5/374;H04N9/07 主分类号 H01L27/14
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