发明名称 Heat dissipation device and heat dissipation method for electronic equipment
摘要 According to one embodiment, fixing plates are formed to a shield case which covers a circuit board including a circuit component. When a heat sink, which has bent heat dissipation plates and can be accommodated in a shield case, is attached to the fixing plates and the surface of the circuit board is covered by the shield case, the heat sink comes into contact with the heat conduction sheet attached to the circuit component.
申请公布号 US2006187643(A1) 申请公布日期 2006.08.24
申请号 US20060348476 申请日期 2006.02.07
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 TSURUFUSA HIDEO
分类号 H05K7/20 主分类号 H05K7/20
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