| 摘要 |
PROBLEM TO BE SOLVED: To obtain a TAB tape and CSP/BGA package structure, that improve wire bonding properties, prevent bonding peel-offs, and improve the yield of products and productivity. SOLUTION: In the TAB tape for potting or transfer mold BGA where a wiring pattern 20 having a land 12 is formed an a copper foil 2 laminated on an insulating film 15 with adhesives, hard copper foil is used as the copper foil 2. For the hard copper foil, the thickness is set to 3 μm to 25 μm, and the Vickers hardness for the copper foil 2 (Hv: measurement load 10 gf) is set at 180 or higher. |
