发明名称 MOLDED STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a molded structure constituted by bonding a molded body to a substrate, especially a low density substrate such as a fiberboard or the like by sufficient bonding force without deforming the substrate. SOLUTION: The trim board 2 of a door trim 1 is constituted of a base material 21, which is formed by impregnating fibers of a plant or the like with polypropylene being a binder so as to connect the fibers, and the skin 22 applied to the surface of the base material 21. After the opening of the cavity 65 formed between a fixed mold 62 and a movable mold 63 is closed by the trim board 2, a thermoplastic resin material is injected in the cavity 65 to mold a bracket 3 on the trim board 2. The joined part 33 of the bracket 3 to the trim board 2 is constituted of the linear part 34 arranged on the outer peripheral edge of the bracket 3 to extend to the surface of the base material 21 and branch parts 35 projected to the outside of the bracket 3 on the base material 21 from the linear part 34. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006212824(A) 申请公布日期 2006.08.17
申请号 JP20050025512 申请日期 2005.02.01
申请人 TOYOTA BOSHOKU CORP;DAIWA KASEI IND CO LTD 发明人 WATABE SHINGO;SUZUKI MAKOTO;KARASAWA YUSAKU
分类号 B29C33/42;B29C45/14;B29C45/26 主分类号 B29C33/42
代理机构 代理人
主权项
地址