| 摘要 |
PROBLEM TO BE SOLVED: To provide a simplified method for processing a structure surface so as to contain a surface higher in a first region and a surface lower in a second region. SOLUTION: A plurality of layers are formed on a surface, and a lower layer 13 indicates polishing rate higher than that for an upper layer 14, and also, the thicknesses of the plurality of layers are greater than a step height. Thereafter, the plurality of layers are chemically and mechanically polished so as to remove at least a part of the lower layer 13 in the first region. By the use of this method, a leveling can yet be enhanced further. Further, after a wet-cleaning process, a small upper contact opening is obtained, and deformation of the contact opening caused by an annealing processing is decreased. COPYRIGHT: (C)2006,JPO&NCIPI
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