发明名称 RESIN COMPOSITION FOR SEALING LIGHT-EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy-modified polysiloxane having excellent light resistance and excellent adhesion and useful for sealing a light-emitting element. <P>SOLUTION: A thermosetting composition for sealing the light-emitting element contains the modified polysiloxane which has two or more organic groups having an epoxy unit in a molecule thereof, wherein the modified polysiloxane simultaneously satisfies requisites (A) and (B) as follows: (A) a molecular weight peak value Mp of the modified polysiloxane is not less than 1,000 and less than 4,500; and (B) a content of low molecular weight fraction having a molecular weight of not more than 1,000 is not more than 15% in the the modified polysiloxane. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006213760(A) 申请公布日期 2006.08.17
申请号 JP20050025261 申请日期 2005.02.01
申请人 ASAHI KASEI CORP 发明人 KURODA YOSHITO;KACHI HAJIME
分类号 C08G59/20;C08G77/14;C08G77/38;H01L23/29;H01L23/31;H01L33/56 主分类号 C08G59/20
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