| 摘要 |
PROBLEM TO BE SOLVED: To improve yields by accurately grasping the temperature of the surface of a semiconductor wafer to be dry-polished to thereby enable the operational management of dry polish for preventing the temperature from reaching the level that causes defects. SOLUTION: A hollow part 28 is formed at a rotation axis 22 of a polish unit 20 and the rotation center of a polish wheel 24 across both of them. A non-contact temperature sensor 40 is inserted into the hollow part 28 while a sensor 42 is near the opening on the polish wheel 24 side, and adjoins the surface of the semiconductor wafer W to be polished. A control unit 50 determines whether the temperature detected by the temperature senser 40 exceeds a detected allowable temperature, and proceeds with polishing or performs feedback control for retracting the polish unit 20 based on the content of determination. COPYRIGHT: (C)2006,JPO&NCIPI
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