| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method for a semiconductor chip capable of applying nondestructive inspection, even in any semiconductor chip and even under a production, irrespective of a shape of a wiring pattern for a circuit. SOLUTION: In this inspection method for the semiconductor chip 1 formed with a pn junction 6 for inspection in a portion other than an area of a wire 3 for a circuit, and formed with a wire 7 for the inspection for bringing both fellow electrode parts of the pn junction for the inspection into continuity, and having a midway of the wire for the inspection laid along the wire for a circuit, a laser beam R is emitted to the pn junction to generate an OBIC current I, a magnetic flux B generated in the periphery of the OBIC current is detected by a SQUID element 12, when the OBIC current flows in the wire for the inspection, and a detection distribution pattern of the magnetic flux detected by the SQUID element is compared with a reference distribution pattern of the magnetic flux preliminarily found in a normal case to detect the presence of a wiring defect in the semiconductor chip. COPYRIGHT: (C)2006,JPO&NCIPI
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