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发明名称
APPARATUS FOR MOUNTING SOLDER BALL ONTO WAFER
摘要
申请公布号
KR100614767(B1)
申请公布日期
2006.08.16
申请号
KR20050024495
申请日期
2005.03.24
申请人
HANMISEMICONDUCTOR CO., LTD.
发明人
JUNG, HYUN GYUN;KIM, BYOUNG SUK;JUNG, JAE WOOK;YOON, SUNG KYU
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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