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发明名称
TACK BOINDING APPARATUS USING ULTRASONIC WAVES FOR MANUFACTURING IC CARD
摘要
申请公布号
KR100614501(B1)
申请公布日期
2006.08.14
申请号
KR20050031612
申请日期
2005.04.15
申请人
KSB CO., LTD.
发明人
PARK, JONG BOK
分类号
B29C65/08;B29C65/02
主分类号
B29C65/08
代理机构
代理人
主权项
地址
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