发明名称 MANUFACTURING METHOD OF BONDING WIRE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a bonding wire wherein a thin and uniform noble metal coated film is formed on the surface of a nonmetallic bonding wire with a simplified technique. <P>SOLUTION: The &le;1 &mu;m thick noble metal coated film is formed by applying and then heating a liquid composition containing noble metal particles each having a &le;100 nm particle diameter, on the surface of a nonmetallic system bonding wire processed into a desired wire diameter. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210642(A) 申请公布日期 2006.08.10
申请号 JP20050020683 申请日期 2005.01.28
申请人 SUMITOMO METAL MINING CO LTD 发明人 YAGINUMA KIYOSHI
分类号 H01L21/60 主分类号 H01L21/60
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