发明名称 |
Electroplating pcb components |
摘要 |
Curved out of plane metal components are formed on PCB substrates ( 11 ) by electroplating two layers ( 13, 14 ) of the same metal such that each layer has a different internal stress. This produces as curvature of the layer ( 13, 14 ) which enables coils, curved cantilever beams and springs to be fabricated. The amplitude and direction of curvature can be controlled by controlling the stress and thickness of each layer. The stress is controlled by controlling the composition of the electroplating bath.
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申请公布号 |
US2006175203(A1) |
申请公布日期 |
2006.08.10 |
申请号 |
US20050548277 |
申请日期 |
2005.09.09 |
申请人 |
MICRO RELAY HOLDINGS PTY LTD. |
发明人 |
DAVIS TIMOTHY J.;SEXTON BREET |
分类号 |
H01R13/02;B81B3/00;B81C1/00;C25D5/10;C25D5/12;H05K3/40 |
主分类号 |
H01R13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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