| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless nickel-phosphorus plating film which is excellent in flexibility and has a small internal stress and hardly increases the internal stress even if heated, and also to provide an electroless nickel-phosphorus plating bath appropriate for formation of such electroless nickel-phosphorus plating film. SOLUTION: The electroless nickel-phosphorus plating film composed of columnar crystals oriented in the thickness direction of the electroless nickel-phosphorus plating film formed on an object to be plated and the electroless nickel-phosphorus plating bath containing a water-soluble nickel salt and hypophosphorous acid and/or its salt, aminocarboxylic acid and/or its salt, and not containing organic carboxylic acid exclusive of aminocarboxylic acid and/or its salt are provided. A flexible substrate formed with the plating film has the highly flexible film and substantially prevents the occurrence of a crack and peeling in the film. A silicon wafer formed with the plating film has the small internal stress of the film and warping of the silicon wafer is hardly formed by the heating treatment. COPYRIGHT: (C)2006,JPO&NCIPI
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