| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is excellent in performances, such as transmissivity, insulation, flatness, and chemical resistance, and also made suitable to use as an interlayer insulation film in a LCD manufacturing process securing the reliability in the following processes by minimizing the gas leakage especially through the high heat resistant interlayer insulation films. <P>SOLUTION: The photosensitive resin composition by this invention contains, (a) (i) a phenyl maleimide system compound, (ii) unsaturated carboxylic acid, unsaturated carboxylic anhydride, or their mixture, and (iii) acrylic copolymerization obtained by copolymerizing an epoxy group containing unsaturated compound, (b)1, 2-quinonediazido compounds, and (c) a solvent. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
