| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device having a plurality of reliable bump electrodes, where working conditions, such as temperature and pressure, related to the formation of an electrode are not limited by each peculiar condition of an electronic device or the like provided on a device substrate. SOLUTION: The device substrate 4 on the surface of which the electronic device or the like 5 and a pad electrode 6 are provided is prepared. Then, a via-hole 3 is formed on a first support substrate 1 made of glass or the like instead of on a device substrate 4, and the first support substrate 1 is adhered onto the surface of the device substrate 4 so that the bottom section of the via-hole 3 overlaps with the surface of the pad electrode 6. A bump electrode 10 is formed in the via-hole 3 via a barrier metal layer 8. COPYRIGHT: (C)2006,JPO&NCIPI
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