发明名称 Thin film patterning arrangement
摘要 A thin film patterning arrangement ( 6 ), comprising a substrate ( 1 ) and barriers ( 3 ) arranged to partition a surface of the substrate ( 1 ) into sub-areas ( 5 ) is disclosed. Said surface is of a polymeric material, and is coated with an at least partly inorganic coating ( 2 ). Thin film material ( 4 ) is preferably deposited on said thin film patterning arrangement ( 6 ).
申请公布号 US2006172123(A1) 申请公布日期 2006.08.03
申请号 US20040564298 申请日期 2004.07.08
申请人 DUINEVELD PAULUS C;SLIKKERVEER PETER J 发明人 DUINEVELD PAULUS C.;SLIKKERVEER PETER J.
分类号 B41M5/00;B41M3/00;B41M5/52;G02B5/20 主分类号 B41M5/00
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