发明名称 |
Thin film patterning arrangement |
摘要 |
A thin film patterning arrangement ( 6 ), comprising a substrate ( 1 ) and barriers ( 3 ) arranged to partition a surface of the substrate ( 1 ) into sub-areas ( 5 ) is disclosed. Said surface is of a polymeric material, and is coated with an at least partly inorganic coating ( 2 ). Thin film material ( 4 ) is preferably deposited on said thin film patterning arrangement ( 6 ).
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申请公布号 |
US2006172123(A1) |
申请公布日期 |
2006.08.03 |
申请号 |
US20040564298 |
申请日期 |
2004.07.08 |
申请人 |
DUINEVELD PAULUS C;SLIKKERVEER PETER J |
发明人 |
DUINEVELD PAULUS C.;SLIKKERVEER PETER J. |
分类号 |
B41M5/00;B41M3/00;B41M5/52;G02B5/20 |
主分类号 |
B41M5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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