Semiconductor device, semiconductor module, and manufacturing method of semiconductor device

摘要

An imaging device as a semiconductor device includes a semiconductor substrate on which an imaging element is mounted, a light-transmitting lid section (covering section) arranged to face a light receiving section provided on one surface of the imaging element, and an adhesive layer arranged in an area excluding the light receiving section on the one surface of the imaging element for bonding between the semiconductor substrate and the lid section. The adhesive layer ranges from 10 g/(m2·24h) to 200 g/(m2·24h) in the water vapor permeability.