| 摘要 |
PROBLEM TO BE SOLVED: To clean a wafer stably without impeding the rotation of the wafer upon cleaning the wafer. SOLUTION: In a forward direction movement range where a movement direction of a wafer surface following the rotation of a wafer 14 is the same direction as a movement direction of a cleaning brush surface in accordance with the rotation of a cleaning blush 13, the cleaning blush 13 faces the wafer surface from the center of the wafer surface to the periphery of the wafer surface. In an opposite direction movement range of the wafer surface where the movement direction of the wafer surface following the rotation of the wafer 14 is in an opposite direction to that of the surface of the cleaning blush in accordance with the rotation of the cleaning blush 13, the size of the cleaning blush 13 facing the wafer surface is 0 to 95% of a radius (r) of the wafer. COPYRIGHT: (C)2006,JPO&NCIPI
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