| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing a light-emitting device which is inexpensive and can efficiently radiate the heat generated in a semiconductor light-emitting device. <P>SOLUTION: The package 10 for housing a light-emitting device is of a sheet array type, wherein a plurality of semiconductor light-emitting devices 12 such as LEDs are mounted to a substrate 11. In this case, the substrate 11 is provided with a circuit copper plate 14 on the upper surface of a ceramic substrate 13, wherein a wiring circuit is provided to transfer and radiate heat generating in the semiconductor light-emitting devices 12 and to be electrically connected with the semiconductor light-emitting devices 12, and a solid copper plate 16 on the lower surface of the ceramic substrate 13 that transfers and radiates heat generating in the circuit copper plate 14. The circuit copper plate 14 and the solid copper plate 16 are jointed to each other by DBC, method that can directly connect the solid copper plate 16 to a baked ceramic substrate 13, or by an active metallic brazing material jointing method. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
