WAFER LEVEL CHIP SCALE PACKAGE OF IMAGE SENSOR AND MANUFACTURING METHOD THEREOF,申请号KR20050041059-传众专利搜索

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发明名称	WAFER LEVEL CHIP SCALE PACKAGE OF IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
摘要
申请公布号	KR100609121(B1)	申请公布日期	2006.07.27
申请号	KR20050041059	申请日期	2005.05.17
申请人	SAMSUNG ELECTRO-MECHANICS CO., LTD.	发明人	RYU, JIN MUN
分类号	H01L27/146	主分类号	H01L27/146
代理机构		代理人
主权项
地址

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