发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus for suppressing the generation of plasma outside a buffer chamber. SOLUTION: The substrate treatment apparatus comprises a treatment chamber for storing a substrates; a gas supplying means for supplying treatment gas into the treatment chamber; a pair of electrodes that generate plasma by applying a high-frequency voltage and perform the plasma excitation of treatment gas supplied from the gas supplying means by the generated plasma; and a voltage application means for applying high-frequency voltages to the pair of electrodes so that the phase of a voltage at one of the pair of electrodes becomes opposite to that of the other electrode. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006190875(A) 申请公布日期 2006.07.20
申请号 JP20050002398 申请日期 2005.01.07
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 ISHIMARU NOBUO
分类号 H01L21/31;C23C16/509 主分类号 H01L21/31
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