| 摘要 |
A water-cooling apparatus for semiconductor thermal processing compring two supply pipes and two recycle pipes for respectively connecting to two chambers for performing the semiconductor processing. Each chamber has one set of pipes for supplying and recycling the cooling water in order to adjust the temperature in the chambers and maintain sufficient water pressure and flow, thereby preventing insufficient water pressure, thereby resulting in increased throughput. A water pump is not required in order to increase the water pressure, thereby reducing the maintenance cost.
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