Component arrangement for serial connection with high voltage application has semiconductor chip, load connections, and control port whereby first and second load connection are arranged on opposite sides of semiconductor chip

摘要

Component arrangement has semiconductor chip (10), load connections, and control port whereby first and second load connection are arranged on opposite sides of semiconductor chip. Chip carrier (21), on which semiconductor chip is arranged, is connected electrically and thermally leading with first load connection of semiconductor body. Contact part (22) is arranged which is connected to second load connection and is electrically and thermally leading. Dielectric mass is surrounded by semiconductor chip, carrier chip and contact part and form a housing. Chip carrier lies exposed at first side (31) of housing and contact part lies exposed on second side (32) of housing opposite to first side. Control port is connected electrically leading with a connection leg (23), which is led out from the housing. An independent claim is also included for the component cascade with two pile-like component arrangement arranged one on another.