发明名称 |
PROCESSING METHOD AND DEVICE FOR FORMING CONDUCTIVE PATTERN |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a processing method and a processing device enabling mass production and for stably obtaining conductive patterns with high conductivity. <P>SOLUTION: The processing method is for forming a conductive pattern on a substrate by applying development treatment and removal treatment of a silver halide emulsion layer while conveying a precursor after exposing the precursor having at least a physical development nuclear layer and the silver halide emulsion layer in that order on the substrate. At least during the development process, a face with the physical development nuclear layer and the silver halide emulsion layer is to be conveyed in a non-contact state. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
申请公布号 |
JP2006190535(A) |
申请公布日期 |
2006.07.20 |
申请号 |
JP20050000681 |
申请日期 |
2005.01.05 |
申请人 |
MITSUBISHI PAPER MILLS LTD |
发明人 |
SHIBATA YOSHIO;TAKEI TAKANORI |
分类号 |
H01B13/00;G06F3/041;H05K3/18 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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