发明名称 PROCESSING METHOD AND DEVICE FOR FORMING CONDUCTIVE PATTERN
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a processing method and a processing device enabling mass production and for stably obtaining conductive patterns with high conductivity. <P>SOLUTION: The processing method is for forming a conductive pattern on a substrate by applying development treatment and removal treatment of a silver halide emulsion layer while conveying a precursor after exposing the precursor having at least a physical development nuclear layer and the silver halide emulsion layer in that order on the substrate. At least during the development process, a face with the physical development nuclear layer and the silver halide emulsion layer is to be conveyed in a non-contact state. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006190535(A) 申请公布日期 2006.07.20
申请号 JP20050000681 申请日期 2005.01.05
申请人 MITSUBISHI PAPER MILLS LTD 发明人 SHIBATA YOSHIO;TAKEI TAKANORI
分类号 H01B13/00;G06F3/041;H05K3/18 主分类号 H01B13/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利