| 摘要 |
A printed circuit board includes a substrate on which an insertion hole and a circuit are formed, and a metal dissipating plate fixedly inserted in the insertion hole. A light emitting diode package may be made using the printed circuit board, including a plastic printed circuit board provided with an insertion hole and a circuit portion; a light emitting diode chip emitting light when an electric signal is applied thereto from the circuit portion; a dissipating plate fixedly inserted in the insertion hole, the light emitting diode chip being mounted on the dissipating plate; a light reflector/collector for collecting/reflecting light emitted from the light emitting diode chip; a bonding wire for electrically connecting the circuit portion to the light emitting diode chip; and an epoxy resin molded on the board to protect the chip and the wire. |
