| 摘要 |
A manufacturing method of a semiconductor device includes a support member for fixing a semiconductor chip, the support member being formed between leads without applying stress to the leads. The semiconductor device includes a plurality of leads composing a lead frame, a resin island (a support member) that is formed between the leads, a semiconductor chip that is fixed on the resin island and is electrically connected to the leads by bonding wires, and sealing resin for partially sealing the semiconductor chip, the bonding wire, and the lead by resin, wherein a liquid cured resin is formed (filled) between the leads to form the resin island (the support member).
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