发明名称 MANUFACTURING METHOD OF RESIN PRODUCT AND MOLDING APPARATUS FOR RESIN PRODUCT
摘要 PROBLEM TO BE SOLVED: To prevent the nozzle forming part of a molding die, which is used for fabricating a nozzle hole even smaller than the conventional one and correspondingly is thin and fragile, from causing the fall in durability and breakages, and to make the manufacturing apparatus less expensive compared with the conventional expensive injection molding machine or excimer laser apparatus. SOLUTION: The resin product is manufactured by the press process and the electrical discharge process. In the press process the molding face of the die member, on which a (conductive) projection having a sharp tip is arranged, is brought into contact with and pressed against a substrate which is held on a conductive holding stand and consists of an insulating resin composition containing a thermoplastic resin, while the substrate is heated. In the electrical discharge process the substrate is bored by causing the electrical discharge to generate between the holding stand and the projection when the holding face holding the substrate on the holding stand and the tip of the projection of the die member reach a predetermined distance. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006181902(A) 申请公布日期 2006.07.13
申请号 JP20040378811 申请日期 2004.12.28
申请人 KONICA MINOLTA HOLDINGS INC 发明人 MIYAURA TOMOKO;HOSONO MIYUKI;SHIRAI TAKAAKI
分类号 B29C43/02;B23H9/14;B29C43/32;B30B15/34 主分类号 B29C43/02
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